$160.00
Availability: 106 left in stock

High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power...

Categories:

Guaranteed safe checkout:

apple paygoogle paymasterpaypalshopify payvisa
Sic Power Module Design: Performance, Robustness and Reliability
- +

High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging.

This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs.

Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.



Author: Alberto Castellazzi
Binding Type: Hardcover
Publisher: Institution of Engineering & Technology
Published: 02/03/2022
Series: Energy Engineering
Pages: 360
Weight: 1.6lbs
Size: 9.40h x 6.30w x 0.90d
ISBN: 9781785619076

About the Author
Castellazzi, Alberto: -

Alberto Castellazzi is a professor at the Kyoto University of Advanced Science, Japan. His research focuses on advanced solid-state power processing, including the characterization and use of wide-band-gap semiconductor devices. He has 20 years' experience in power electronics R&D from both industry and academia, including University of Nottingham, UK, SIEMENS (Germany), ETH Zurich (Switzerland), and ALSTOM (France). He is a member of The Power Electronic Conversion Technology Annex (PECTA) of the IEA.

Irace, Andrea: -

Andrea Irace is a professor of electronics at the University of Naples Federico II, Italy. His research focuses on modelling and simulation of WBG devices for power electronics. Prior assignments included the Delft Institute of Microelectronics and Submicron Technology. He has authored more than 120 papers in international publications.

Ezra's Archive Does not ship outside of the United States

Delivery Options:

1. Economy: 

Estimated Delivery Time - 5 to 8 Business Days

Shipping Cost - $4.15

2. USPS Priority:

Estimated Delivery Time - 1 to 3 Business Days 

Shipping Cost - $8.85

3. Free Economy Shipping: Only Applicable to Orders over $60

Returns and Refunds: 

Purchased items are not eligible to be returned. However, a refund or item replacement may be granted should an item be damaged or misplaced during shipping. To make a refund or replacement claim please contact us via email at Ezra'sArchive@outlook.com